TUTORIALS

Due to low number of registered EMPC committee had to cancel Tutorials 2 and 5.

Please observe:
Tutorial 1: Reliability Basics, Olli Salmela, Nokia,
Tutorial 3: From Component Level to System-Level Reliability Estimates, Olli
Salmela, Nokia,
Tutorial 4: Embedded Chip SiP for Cost Effective 3D Packaging, Chuck Bauer,
TechLead Corp.
ARE now open for additional registration up to June 11!

#1 Olli Salmela, Nokia: Reliability Basics

#2 Peter van Daele, NEMO: Photonics packaging and integration

#3 Olli Salmela, Nokia: From Component Level to System-Level Reliability Estimates

#4 Chuck Bauer, TechLead Corp.: Embedded Chip SiP for Cost Effective 3D Packaging

#5 Jukka Hast, VTT: Principles of Roll-to-Roll manufacturing technologies for printed electronics, optics and optoelectronics manufacturing

#6 Leszek Golonka, Wroclaw University of Technology: LTCC (Low Temperature Cofired Ceramics) sensors, actuators and microsystems

invitation

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conference PCO

tutorials